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ID#: 9115929Model:
Datacon Die Attach
2200 EvoWafer Size:
8'Die attacher, 8' In-line SMEMA configuration
Hard disk upgraded to SSD
Spare parts included
Equipment module:
Dynamic XYZ theta servo motors: yes
Theta axis rotary bond-head: yes
Programmable lighting systems with RGB light: yes
Datacon pattern recognition system with edge, pattern, and ink-dot recognition:
Programmable
IPU
CMOS Substrate camera/optics/illumination: Yes
Upward looking camera: Yes
Downward looking camera: Yes
Wafer camera: Yes
Programmable bond force (up to 7000 grams): Yes
Bond force sensor and mini-BMC kit: Yes
Ionizer:
Main axis: Yes
Substrate transport system:
Current transport system configuration:
Heated stage of up to 150 DC temperature
Flatboat configuration
BETS (Belt Elevation TS)
Belt classic transport system:
BETS
Component presentation system:
Wafer lifter and changer: Yes
Wafer table with stretcher: Yes
Additional frame down-holding application for 8' and 12' wafer:
Adaptor for 8'
Wafer frame adapter for automatic change: Yes
Wafer ring adapter for automatic change: Hoop ring adaptor
Waffle pack (Gel pack) holder 2':
Waffle pack adaptor
Separate gel-pack adaptor
Waffle pack (Gel pack) holder 4':
Waffle pack adaptor
Separate gel-pack adaptor
Tape and reel presentation: No
SEMS / GEMS Compliant: Capable but not activated
Input / Output system:
Magazine handler:
SMEMA Ready
I/O equipment: No
Die handling system:
Automatic tool changer unit 7-slot: Yes
Tool holders and tools:
Standard tool holder (shank and tip): Yes
Ejector system:
Single-chip ejector unit: Yes
Upgrade to multi-chip ejection carousel: Yes
Eject tool base: Yes
Needle kit: No
Epoxy application system:
Dispenser-pressure/time:
Time / Pressure
Volumetric pump
Epoxy stamping system:
Time / Pressure
Volumetric pump
Auger or positive displacement:
Configured based on solar product
Flip chip station
Automatic tool changer:
(7) Slots
Die attach
Flip chip capability
ID Axis
Jetter system: Yes
Built-in vacuum pump: Disconnected, but available
Heated stage (150°C): Yes
Vision system with up and down looking cameras
Placement accuracy: 10 µm (3 sigma)
Programmable bond force (7000 grams)
Die pick from wafer, waffle pack, gel pack - Wafer up to 12” with 8' adapter
Waffle pack / Gel-Pak® 2” x 2” and 4” x 4”
Substrate working range: 8'
ID Integrated dispenser for classic transport system
Dispenser volumetric screw pump (ID Axis)
P-Part for automatic transport system (for ID axis)
Calibration tool kit: No
208V/220V Power compatibility: 3Phase - 400V
Machine software installation disk: No
Integrated dispenser
Vision alignment
Pick & place head
X / Y Placement accuracy: ± 7 μm @ 3s
Theta placement accuracy: ± 0.15° @ 3s
Die attach: Disconnected
Heated bond head and plate
Standard bond head: 0° - 360° Rotation
Equipment operating and maintenance manual or CD-ROM: Yes
CE Marked
Currently crated
2008 vintage.
Datacon 2200 Evo Manual Transmission
Datacon 2200 Evo Manual Online
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